The CADroom.com Design
Review examines critical electrical, mechanical, and documentation aspects
of the printed circuit board design. Among the considerations are:
- Electrical
- Design Constraints and Rules
- Current Carrying Requirements per Trace
- Signal, Power, Ground Layer Requirements
- Minimum Spacing, Minimum Trace Width
- Via Constraints
- Thermal Ground Issues including Thermal Vias
- Split Planes
- Layer Stack-Up Configuration
- Impedance Control
- Picket Fencing, RF stitching Vias
- Shielding Vias
- Mechanical
- Component Height Restrictions
- Maximum Number of Layers
- Maximum Board Thickness
- Pre-Placed Component Data
- Use of Off-Board Components
- Location of Wiring Terminations
- Thermal Considerations, Heat Sinks, etc.
- Fiducials
- Breakaways
- Documentation
- Fabrication and Assembly Drawings
- PDF Files e.g. 12-Layer Board, 5706 KB (pdf file, Acrobat Reader required)
- Pen Plots
- Photo Plots
- Pick and Place File
- Gerber Files
- ODB++ Files
- Peripheral Layout Documents: Soldermask, Silkscreen, Paste Screen Mask
- Parts List e.g. Parts List, 24 KB (pdf file, Acrobat Reader required)
You can get a free PDF reader here:
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